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  september 2011 doc id 5386 rev 7 1/11 11 stps20h100c 100 v power schottky rectifier features negligible switching losses high junction temperature capability good trade off between leakage current and foward voltage drop low leakage current avalanche rated insulated package: to-220fpab ? insulating voltage = 2000 v dc ? capacitance = 45 pf avalanche capability specified description dual center tap schottky rectifier designed for high frequency miniature switched mode power supplies such as adaptators and on board dc/dc converters. j table 1. device summary symbol value i f(av) 2 x 10 a v rrm 100 v t j (max) 175 c v f (max) 0.64 v a1 a2 k d 2 pak stps20h100cg i 2 pak stps20h100cr stps20h100cr-h to-220fpab stps20h100cfp to-220ab stps20h100ct stps20h100ct-h a1 k a2 a1 k a2 a1 k a2 a1 k a2 www.st.com
characteristics stps20h100c 2/11 doc id 5386 rev 7 1 characteristics when the diodes 1 and 2 are used simultaneously: tj(diode 1) = p(diode1) x r th(j-c) (per diode) + p(diode 2) x r th(c) table 2. absolute ratings (limiting values, per diode) symbol parameter value unit v rrm repetitive peak reverse voltage 100 v i f(rms) forward rms current 30 a i f(av) average forward current = 0.5 to-220ab d 2 pak / i 2 pa k t c = 160 c per diode 10 a to-220fpab t c = 145 c per device 20 i fsm surge non repetitive forward current t p = 10 ms sinusoidal 250 a i rrm repetitive peak reverse current t p = 2 s square f= 1 khz 1 a i rsm non repetitive peak reverse current t p = 100 s square 3 a p arm repetitive peak avalanche power t p = 1 s t j = 25 c 10800 w t stg storage temperature range -65 to + 175 c t j maximum operating junction temperature (1) 1. condition to avoid thermal runaway for a diode on its own heatsink 175 c dv/dt critical rate of rise of reverse voltage 10000 v/s table 3. thermal resistance symbol parameter value unit r th(j-c) junction to case to-220ab / d 2 pak / i 2 pak per diode 1.6 c/w to-220fpab per diode 4 to-220ab / d 2 pa k / i 2 pak total 0.9 c/w to-220fpab total 3.2 r th(c) to-220ab / d 2 pa k / i 2 pak coupling 0.15 c/w to-220fpab coupling 2.5 dptot dtj < 1 rth(j-a)
stps20h100c characteristics doc id 5386 rev 7 3/11 to evaluate the conduction losses use the following equation: p = 0.55 x i f(av) + 0.009 i f 2 (rms) table 4. static electrical characteristics (per diode) symbol parameter test condi tions min. typ. max. unit i r (1) 1. pulse test: t p = 5 ms, < 2% reverse leakage current t j = 25 c v r = v rrm 4.5 a t j = 125 c 2 6 ma v f (2) 2. pulse test: t p = 380 s, < 2% forward voltage drop t j = 25 c i f = 8 a 0.71 v t j = 25 c i f = 10 a 0.77 t j = 25 c i f = 16 a 0.81 t j = 25 c i f = 20 a 0.88 t j = 125 c i f = 8 a 0.56 0.58 t j = 125 c i f = 10 a 0.59 0.64 t j = 125 c i f = 16 a 0.65 0.68 t j = 125 c i f = 20 a 0.67 0.73
characteristics stps20h100c 4/11 doc id 5386 rev 7 figure 1. average forward power dissipation versus average forward current (per diode) figure 2. average forward current versus ambient temperature ( = 0.5, per diode) p (w) f(av) 024681012 0 2 4 6 8 t =tp/t tp i (a) f(av) = 0.05 = 0.1 = 0.2 = 0.5 = 1 i (a) f(av) 0 25 50 75 100 125 150 175 0 2 4 6 8 10 12 to-220fpab to-220ab r=r th(j-a) th(j-c) r =15c/w th(j-a) r =40c/w th(j-a) t (c) amb t =tp/t tp figure 3. normalized avalanche power derating versus pulse duration figure 4. normalized avalanche power derating versus junction temperature 0.001 0.01 0.1 0.01 1 0.1 10 100 1000 1 p(t p ) p (1s) arm arm t (s) p 0 0.2 0.4 0.6 0.8 1 1.2 25 50 75 100 125 150 p(t) p (25 c) arm j arm t (c) j figure 5. non repetitive surge peak forward current versus overload duration (maximum values, per diode) figure 6. non repetitive surge peak forward current versus overload duration (maximum values, per diode) i (a) m 1e-3 1e-2 1e-1 1e+0 0 20 40 60 80 100 120 140 160 180 200 i m t =0.5 t(s) t =50c c t =75c c t =125c c to-220ab, d pak, i pak 22 1e-3 1e-2 1e-1 1e+0 0 20 40 60 80 100 120 140 i (a) m i m t =0.5 t(s) t =50c j t =75c j t =125c j to-220fpab
stps20h100c characteristics doc id 5386 rev 7 5/11 figure 7. relative variation of thermal impedance junction to case versus pulse duration (per diode) figure 8. relative variation of thermal impedance junction to case versus pulse duration (per diode) z/r th(j-c) th(j-c) 1e-3 1e-2 1e-1 1e+0 0.0 0.2 0.4 0.6 0.8 1.0 t =t /t p tp t (s) p = 0.5 = 0.2 = 0.1 single pulse to-220ab, d pak, i pak 22 1e-2 1e-1 1e+0 1e+1 0.0 0.2 0.4 0.6 0.8 1.0 z/r th(j-c) th(j-c) t =tp/t tp t (s) p = 0.5 = 0.2 = 0.1 single pulse to-220fpab figure 9. reverse leakage current versus reverse voltage applied (typical values, per diode) figure 10. junction capacitance versus reverse voltage applied (typical values, per diode) i (a) r 0 102030405060708090100 1e-2 1e-1 1e+0 1e+1 1e+2 1e+3 1e+4 v (v) r t =125c j t =150c j t =100c j t =25c j 1 2 5 10 20 50 100 100 200 500 1000 c(pf) v (v) r f=1mhz v =30mv t =25c osc rms j figure 11. forward voltage drop versus forward current (maximum values, per diode) figure 12. thermal resistance junction to ambient versus copper surface under tab i (a) fm 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0.1 1.0 10.0 100.0 v (v) fm t =125c (typical values) j t =25c j t =125c j t =150c (typical values) j r (c/w) th(j-a) 0 5 10 15 20 25 30 35 40 0 10 20 30 40 50 60 70 80 s(cu)(cm2)
package information stps20h100c 6/11 doc id 5386 rev 7 2 package information epoxy meets ul94, v0 cooling method: by conduction (c) recommended torque value: 0.4 to 0.6 nm in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. table 5. to-220ab dimensions ref dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 c 1.23 1.32 0.048 0.051 d 2.40 2.72 0.094 0.107 e 0.49 0.70 0.019 0.027 f 0.61 0.88 0.024 0.034 f1 1.14 1.70 0.044 0.066 f2 1.14 1.70 0.044 0.066 g 4.95 5.15 0.194 0.202 g1 2.40 2.70 0.094 0.106 h2 10 10.40 0.393 0.409 l2 16.4 typ. 0.645 typ. l4 13 14 0.511 0.551 l5 2.65 2.95 0.104 0.116 l6 15.25 15.75 0.600 0.620 l7 6.20 6.60 0.244 0.259 l9 3.50 3.93 0.137 0.154 m 2.6 typ. 0.102 typ. diam. 3.75 3.85 0.147 0.151 a c d l7 dia l5 l6 l9 l4 f h2 g g1 l2 f2 f1 e m
stps20h100c package information doc id 5386 rev 7 7/11 table 6. to-220fpab dimensions ref dimensions millimeters inches min. max. min. max. a 4.4 4.6 0.173 0.181 b 2.5 2.7 0.098 0.106 d 2.5 2.75 0.098 0.108 e 0.45 0.70 0.018 0.027 f 0.75 1 0.30 0.039 f1 1.15 1.70 0.045 0.067 f2 1.15 1.70 0.045 0.067 g 4.95 5.20 0.195 0.205 g1 2.4 2.7 0.094 0.106 h 10 10.4 0.393 0.409 l2 16 typ. 0.63 typ. l3 28.6 30.6 1.126 1.205 l4 9.8 10.6 0.386 0.417 l5 2.9 3.6 0.114 0.142 l6 15.9 16.4 0.626 0.646 l7 9.00 9.30 0.354 0.366 dia. 3 3.20 0.118 0.126 h a b dia l7 l6 l5 f1 f2 f d e l4 g1 g l2 l3
package information stps20h100c 8/11 doc id 5386 rev 7 table 7. d 2 pak dimensions figure 13. footprint (dimensions in millimeters) ref dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 a1 2.49 2.69 0.098 0.106 a2 0.03 0.23 0.001 0.009 b 0.70 0.93 0.027 0.037 b2 1.14 1.70 0.045 0.067 c 0.45 0.60 0.017 0.024 c2 1.23 1.36 0.048 0.054 d 8.95 9.35 0.352 0.368 e 10.00 10.40 0.393 0.409 g 4.88 5.28 0.192 0.208 l 15.00 15.85 0.590 0.624 l2 1.27 1.40 0.050 0.055 l3 1.40 1.75 0.055 0.069 m 2.40 3.20 0.094 0.126 r 0.40 typ. 0.016 typ. v2 0 8 0 8 g l l3 l2 b b2 e * flat zone no less than 2m m a c2 d r a2 m v2 c a1 * 16.90 10.30 8.90 3.70 5.08 1.30
stps20h100c package information doc id 5386 rev 7 9/11 mounting (soldering) the i 2 pak metal slug (heatsink) with alloy, like a surface mount device, is not permitted. a standard through-hole mounting is mandatory. table 8. i 2 pak dimensions ref. dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 a1 2.40 2.72 0.094 0.107 b 0.61 0.88 0.024 0.035 b1 1.14 1.70 0.044 0.067 c 0.49 0.70 0.019 0.028 c2 1.23 1.32 0.048 0.052 d 8.95 9.35 0.352 0.368 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.195 0.203 e 10 10.40 0.394 0.409 l 13 14 0.512 0.551 l1 3.50 3.93 0.138 0.155 l2 1.27 1.40 0.050 0.055 e l2 l1 b1 d a1 c c2 a b e e1 l
ordering information stps20h100c 10/11 doc id 5386 rev 7 3 ordering information 4 revision history table 9. ordering information order code marking package weight base qty delivery mode stps20h100ct stps20h100ct to-220ab 2.20 g 50 tube stps20h100ct-h stps20h100ct to-220ab 2.20 g 50 tube stps20h100cfp stps20h100cfp to-220fpab 2.0 g 50 tube stps20h100cr stps20h100cr i 2 pak 1.49 g 50 tube stps20h100cr-h stps20h100cr i 2 pak 1.49 g 50 tube stps20h100cg stps20h100cg d 2 pak 1.48 g 50 tube stps20h100cg-tr stps20h100cg d 2 pak 1.48 g 1000 tape and reel table 10. document revision history date revision changes jul-2003 4g previous release. 21-mar-2007 5 removed isowatt package. 10-sep-2007 6 reformatted cover page to current standards - no technical changes. updated dimensions a1, b, b1, c, c2, l, and l1 in ta b l e 8 . 22-sep-2011 7 updated table 8.
stps20h100c doc id 5386 rev 7 11/11 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by two authorized st representatives, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2011 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com


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